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Build Characteristics
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Product Code
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SV-2000-IX
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Product Class
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Servers & Workstations
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Chassis Type
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Convection Cooled 2U Heavy Duty Aluminum Chassis
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Dimensions
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19”W x 3.5H”(2U) x 24”D
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Weight
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42 lbs.
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Mounting
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Slide Mouted in 2U Space (EIA 310 19" Rack/Transit Case)*
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*Order Slides Seperately for Specific Rack/Transit Case Application
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Configuration Characteristics
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Processors
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Up to 2 Intel® Xeon® Processors 5500 or 5600 series
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Chipset
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Intel® 5520 Chipset
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Front Side Bus
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800/1066/1333 MHz
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Cache
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12MB Cache
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Memory
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12x DDR3 Sockets Support Up-to 96GB
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Video Engine
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Server Engine* LLC Pilot II* Controller with 64 MB DDR2 Memory, 8 MB Allocated to Graphics
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Ethernet Controller
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On-Board RJ-45 Network Controller
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PCI Express Support
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1x PCI Express 2.0 x8 Slot (x16 Mechanical)
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3x PCI Express 2.0 x8 Slot (x8 Mechanical)
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1x PCI Express 1.0 x4 Slot (x8 Mechanical Shared with Optional SAS Module)
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1 PCI 32/33 5V Slot
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I/O Characteristics
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Ethernet Ports
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2x RJ-45 Ports
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Serial Port
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1x RJ-45 Port
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USB 2.0 Ports
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2x USB 2.0 Ports (Front Panel)
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4x USB 2.0 Ports (Rear Panel)
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Video Port
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1x VGA Port
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Power Input Ports
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2x IEC 320 w/Retention Brackets
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External Button Boards
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On/Off Switch, Reset Button, Mute Button
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Storage Characteristics
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Storage Type
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Up-to (4) Removable 3.5” SAS or SATA Hard Drives (HDD)
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Front Removable LTO-4 Tape Drive (Up to 3TB per Cartridge)
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Storage Capacity
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Up-to 300GB Each HDD (Contact Sales Rep for Larger Storage Options)
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RAID Options
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RAID 0|1|1E|5|5EE|6|10|50|60|JBOD (with optional RAID Card)
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HDD Mounting
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Removable Locking HD Carrier
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Power Characteristics
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Power Supply Type
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Dual 600W Hot-Swap, Redundant Power Supplies (Active PFC)
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Power Supply Input
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90 – 264VAC Range
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Power Supply Output
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600W Max
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Software Options
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Supported Platforms
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Microsoft® | Linux®
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Contact Sales Rep for Options
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Environmental Characteristics
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High Temperature Operational
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Designed to Meet MIL-STD 810G Method 501.5, Procedure II (50°C)
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Low Temperature Operational
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Designed to Meet MIL-STD 810G Method 502.5, Procedure II (0°C)
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High Temperature Non-Operational
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Designed to Meet MIL-STD 810G Method 501.5, Procedure I (70°C)
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Low Temperature Non-Operational
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Designed to Meet MIL-STD 810G Method 502.5, Procedure I (-20°C)
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Humidity
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Designed to Meet MIL-STD 810G Method 507.5, Procedure II (0-95% Non-Condensing)
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Shock
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Designed to Meet MIL-STD 810G Method 516.6 Procedure I
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Vibration
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Designed to Meet MIL-STD 810G Method 514.6 Procedure I
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Fungus
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Designed to Meet MIL-STD 810G Method 508.6
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Salt/Fog
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Designed to Meet MIL-STD 810G Method 509.5
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Warranty & Tech Support
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Warranty
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(1) Year Parts and Labor Guarantee (Contact Sales Rep for Extended Warranty)
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Tech Support
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24x7 Technical Support Provided By TAG (1-877-824-8324 | supportstaff@tag.com)
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