TAG uses thermal simulation, and finite element analysis, performed using thermal analysis software, to ensure that systems are built to survive the full range of harsh thermal environments encountered by land, air, or sea. TAG engineers have advanced knowledge of component specifications enabling them to design products that are rugged, and meet military standards (MIL-STD) for operating in extreme temperatures. TAG utilizes Thermal Engineering to create systems that are both Convection, and Conduction cooled.
Convection cooling is movement of air through the veins of a heat sync, cooling the system’s processor, and critical components. Conduction cooling is the transfer of heat through a body (heat sync attached to CPU), that can be then dissipated by standard convection airflow. Utilizing an efficient conduction cooling system, TAG has developed Small Form Factor (SSF) rugged systems that do not need any fans to keep them cool. This fan less design allows SSF rugged systems to be sealed, and meet rugged MIL-STD, while using less power.
TAG’s thermal design services include advanced thermal simulation modeling, which allows us to design solutions that combat the harsh climatic conditions to which our products may be exposed in the field. TAG’s standard mechanical engineering services take full advantage of sophisticated Computer-Aided-Design (CAD) and fabrication techniques, which helps to reinforce the overall conceptual design of our products. Thermal simulation and finite element analysis, performed using Flowtherm thermal analysis software, ensure that systems and instruments are designed and built to survive the full range of harsh thermal environments encountered by land, air, or sea.